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Title:
A FEM coupling model for properties prediction during the curing of an epoxy adhesive for a novel assembly of radio telescope panel
Author: Hu, ShouWei(胡守伟) ; Chen, Yi(陈忆)
Issued Date: 2014-07-18
Conference Date: 2014-6-22
Conference Place: Montréal, Quebec, Canada
Keyword: material modeling ; multiphysics FEM ; epoxy adhesive ; cure shrinkage ; viscoelastic effect ; residual stresses
Subject: 天文望远镜::射电望远镜
English Abstract:
The curing of epoxy adhesives is a complex phenomenon where the thermal, the chemistry and the mechanics are coupled. Corresponding material properties such as mechanical and physics properties are evolving with the curing. This paper focuses on their predictions by a multiphisics FEM approach of the thermal, chemical and mechanical couplings involved by the curing for a novel assembly of radio telescope panel. The first part presents the constitutive model of an epoxy adhesive that is considered for the curing. The numerical solving, performed with a specific user subroutine of Ansys, is detailed and allows the study of real three-dimensional structure parts. Residual stresses and strains of different metallic membranes and internal adhesives in the interconnect during the assembly of radio telescope panel are
investigated. The mechanical response of the interconnect is analyzed with respect to the poisson’s ratio, relaxation time and adhesive thickness. It is shown that, although the overall residual stresses at the interconnect increase with the adhesive curing, the local strains have different evolving trends, indicating the possibility of damage and decohesion that might compromise mechanical integrity and interrupt the component processing precision.
Sponsorship: SPIE
Source: Advances in Optical and Mechanical Technologies for Telescopes and Instrumentation
Publisher: SPIE
Content Type: 会议论文
URI: http://ir.niaot.ac.cn/handle/114a32/790
Appears in Collections:中科院南京天光所知识成果_会议论文
天文光谱和高分辨成像技术研究室_会议论文

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Recommended Citation:
Shouwei Hu,Yi Chen. A FEM coupling model for properties prediction during the curing of an epoxy adhesive for a novel assembly of radio telescope panel[C]. 见:. Montréal, Quebec, Canada. 2014-6-22.
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文件名: A FEM coupling model for properties prediction during the curing of an epoxy adhesive for a novel assembly of radio telescope panel.pdf
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