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A FEM coupling model for properties prediction during the curing of an epoxy adhesive for a novel assembly of radio telescope panel
Shouwei Hu; Yi Chen
2014-07-18
Source PublicationAdvances in Optical and Mechanical Technologies for Telescopes and Instrumentation
Volume9151
PagesVol. 915132-1-14
Conference Date2014-6-22
Conference PlaceMontréal, Quebec, Canada
Funding OrganizationSPIE
PublisherSPIE
Abstract
The curing of epoxy adhesives is a complex phenomenon where the thermal, the chemistry and the mechanics are coupled. Corresponding material properties such as mechanical and physics properties are evolving with the curing. This paper focuses on their predictions by a multiphisics FEM approach of the thermal, chemical and mechanical couplings involved by the curing for a novel assembly of radio telescope panel. The first part presents the constitutive model of an epoxy adhesive that is considered for the curing. The numerical solving, performed with a specific user subroutine of Ansys, is detailed and allows the study of real three-dimensional structure parts. Residual stresses and strains of different metallic membranes and internal adhesives in the interconnect during the assembly of radio telescope panel are
investigated. The mechanical response of the interconnect is analyzed with respect to the poisson’s ratio, relaxation time and adhesive thickness. It is shown that, although the overall residual stresses at the interconnect increase with the adhesive curing, the local strains have different evolving trends, indicating the possibility of damage and decohesion that might compromise mechanical integrity and interrupt the component processing precision.
KeywordMaterial Modeling Multiphysics Fem Epoxy Adhesive Cure Shrinkage Viscoelastic Effect Residual Stresses
Subject Area射电望远镜
Document Type会议论文
Identifierhttp://ir.niaot.ac.cn/handle/114a32/790
Collection中国科学院南京天文光学技术研究所_会议论文
天文光谱和高分辨成像技术研究室_会议论文
Recommended Citation
GB/T 7714
Shouwei Hu,Yi Chen. A FEM coupling model for properties prediction during the curing of an epoxy adhesive for a novel assembly of radio telescope panel[C]:SPIE,2014:Vol. 915132-1-14.
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