中国科学院南京天文光学技术研究所机构知识库

The focal plane assembly of wavefront camera is the key imaging device of wavefront  detection camera and the key load of the exoplanet imaging coronagraph module.

In order to  ensure the imaging quality and reduce the dark current and thermal noise, it is necessary to  effectively dissipate the heat of the focal plane CCD and other high-power electronic devices to  ensure the working performance and reliability of the focal plane assembly.

Based on the limited  space and cooling resources, this paper adopts the flexible graphene heat conducting cable and  grooved heat pipes, and carries out detailed thermal design and thermal analysis of its cooling  path.

The finite element model is established by thermal analysis software and thermal  simulation is carried out. in that steady state, the work temperature range of the CCD chip is - 12.8~-10.9℃, which meets the temperature control index, and the work temperatures of other  components are also within the design requirements, which indicate that the thermal design  scheme is reasonable and feasible, and meets the task requirements.